The Honor X10 Max, the next flagship of Huawei’s subsidiary, is revealed in a first benchmark on Geekbench. This new leak confirms the presence of Mediatek’s SoC Dimensity 800 and several key elements of the technical sheet. We also discover a first glimpse of the performance of the smartphone.
On June 27, a benchmark of the Honor X10 Max appeared in the Geekbench database, report our colleagues at GSM Arena. As rumors wanted, the smartphone is powered by The SoC Dimensity 800 from Mediatek. As expected, Huawei is increasingly turning to chipsets designed by Mediatek to power Honor’s mid-range smartphones. Other mid-range devices in the Huawei catalogue, such as the Huawei Enjoy Z, could benefit from the SoC. Deprived of TSMC, and de facto Kirin chips, the Chinese group is trying to get closer to the smelter to ensure the sustainability of its mobile division.
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8GB of RAM to support Mediatek’s SoC Dimensity 800
As a reminder, the Dimensity 800 is a SoC with 8 hearts engraved in 7 nm. It incorporates four Cortex A76 cores and four Cortex A55 cores, all clocked at 2.0 GHz. For the graphic part, there is a Mali-G77TM4. Finally, it incorporates HyperEngine technology designed to enhance the gamer experience with mobile games.
According to the benchmark, the chipset is supported by 8GB of RAM. Unsurprisingly, the Honor X10 Max runs Android 10. Given the U.S. sanctions against Huawei, this is likely anopen source version of Android 10,stripped of Google services. Instead, the group integrates Huawei Mobile Services, including App Galery, an alternative to the Play Store.
On Geekbench, the Honor X10 Max climbs to 539 single core and 2186 in multi core. This is quite promising for a mid-range oriented terminal. According to information shared by TENAA, the Honor X10 Max is covered with a 7-inch screen, powered by a 5,000 mAh battery and equipped with a 48-megapixel main photo sensor. For the record, Honor will unveil the smartphone on July 2.
Source: GSM Arena